Board-Level EMI Shield: GORE™ snapSHOT®

GORE™ SNAPSHOT® EMI Shield is a multi-cavity, lightweight solution that can be thermoformed to virtually any design. The innovative attachment mechanism uses solder spheres as individual mechanical snap features that ensure reliable product performance.

The design and construction of GORE™ SNAPSHOT® EMI Shield increases available space within the enclosure in a variety of ways compared to traditional metal cans or frame-and-lid technology. Designers who opt for thermoformed shields at the outset of a design project can focus on effective board design without being limited by the shape and construction of their EMI shields.