Laminates

The NuPower Xtender™ 12B04A-D27 is a bidirectional amplifier module featuring a small, broadband, high-performance RF amplifier that generates 20 watts of RF power across the L- and S-band frequencies of 1.0 to 2.5 GHz. It is ideal for use in extending the communication range of half-duplex L- or S-band transceivers running constant-envelope or near-constant-envelope waveforms.

The Qorvo QM33120WDK2 Ultra-Wideband Development Kit is an all-in-one solution for developers and engineers working on UWB (Ultra-Wideband) product development and demonstrations.

The Acutime 2000 GPS smart antenna for precise timing and position accuracy provides a simple and cost effective solution for integrating GPS into any communication or mobile system

Qorvo offers the QPD1025 discrete GaN on SiC RF transistor that is ideal for IFF transponder and avionics applications. This device features over 1800 W output power, 65 V operating voltage, and a specific frequency range of 1.0 to 1.1 GHz.

NetSync network synchronizer clocks support Synchronous Ethernet (SyncE)-compliant wander filtering and software adjustment of output frequency and phase for IEEE 1588 applications.

The GORE® PHASEFLEX® Series offers the smallest, lightest, internally ruggedized microwave/RF test assemblies for high density interconnection in RF and uW modular applications as well as in high speed digital testing. These assemblies feature ON cable construction and provide consistent, repeatable measurements with electrical performance up to 18, 26.5, 40, or 50 GHz.

DLI has made a name for themselves through manufacturing high Q, high frequency single layer capacitors that feature gold metallization for wire bonding, thin film technology, and rugged construction. They’re ideal for high frequency applications such as DC blocking, tuning, RF bypass, and filtering.

The passive MMIC bandpass filter die is an ideal solution for small form factor, high rejection filtering. Passive GaAs MMIC technology allows production of smaller filter constructions that replace larger form factor circuit board constructions.