Laminates

dB Control’s family of traveling wave tube amplifiers (TWTAs) features a combined frequency range of 2 to 18 GHz up to 15kW output power. dB Control utilizes our proprietary transformer fabrication, encapsulation and high-voltage potting techniques developed for demanding military applications which results in superior reliability, low cost and ease of maintenance.  Products in this series are ideal for several applications, including: test and measurement, electronic warfare (EW) simulation, RFI/EMI/EMC Testing, electronic countermeasures (ECM), and antenna pattern and radar-cross section measurements.

MP-AR-20 Series mounting plates are designed for use with AR-20 Series amplifiers, offering versatility in mounting orientation and allowing for installation of an AR-20 amplifier from the topside.

Mimix Broadband’s 2 to 18 GHz GaAs MMIC distributed low noise amplifier has a small signal gain of 9.0 dB with a noise figure of 4.5 dB across the band. This MMIC uses Mimix Broadband’s 0.3 µm GaAs PHEMT device model technology, and is based upon optical beam lithography to ensure high repeatability and uniformity

XF leverages the EM principle of superposition to quickly analyze port phase combinations with a single simulation.

The SKY58107-31 meets strict 5G NR and LTE advanced requirements where wider bandwidth (100 MHz) and carrier aggregation are used for higher data rates.

A.H. Systems has designed and manufactured a family of 7 biconical antennas that operate efficiently over the 20 MHz to 18 GHz frequency range. Each antenna is made to provide reliable, repeatable measurements and is suitable for FCC, MIL-STD, VDE, TEMPEST, and immunity testing.

The AMP30008 is a rugged, compact, and lightweight solid state high power pulse amplifier designed for demanding L-Band radar applications.

Heat sinks are used for the dissipation of heat from high performance integrated circuits (ICs). Two different series are featured here; the forged heat sink series, and the extruded heat sink series. These heat sinks feature excellent thermal performance and are applicable to BGA, PGA, PLCC, QFP, and other IC packages.